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IRDC3651
CIRCUIT LAYOUT- BOTTOM LAYER
Solder pads for off-board connections ground are
available on the bottom layer. A portion of the
bottom layer plane is isolated for use as Signal
Ground. Options for making the required single
point of connection between Signal ground and
Power Ground are provided on the top side of the
board.
MX-packaged DirectFets can be mounted on the
bottom side of the board. The bottom–side location
of the DirectFet packages allows convenient
attachment of a heat sink.
The IR3651 controller requires a low voltage
power source (nominally 12V). Elements of a
simple linear voltage regulator are installed on
a circuit pattern provided on the bottom layer to
generate the required voltage from the 48V
input supply.
Alternatively, a separate external 12V supply
can be connected at J12, on the top side of the
board.
Low Voltage
Linear Regulator
Components
Off - board Ground
Connection Pads
DirectFet
Positions
Signal Ground
Heat Sink mounting area (optional)
Plane
Figure 3 – Bottom layer of the IR3651 evaluation board.
Rev 1.1
12/20/2006
RD-0616
4
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